The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 27, 2024
Filed:
Aug. 10, 2022
Applicant:
Micron Technology, Inc., Boise, ID (US);
Inventors:
Sean S. Eilert, Penryn, CA (US);
Kunal R. Parekh, Boise, ID (US);
Aliasger T. Zaidy, Seattle, WA (US);
Glen E. Hush, Boise, ID (US);
Assignee:
Micron Technology, Inc., Boise, ID (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06F 13/00 (2006.01); G11C 11/4093 (2006.01); G06F 13/16 (2006.01); G06F 3/06 (2006.01); G11C 11/4096 (2006.01); H01L 23/00 (2006.01); H01L 25/065 (2023.01); H01L 21/78 (2006.01); H01L 21/66 (2006.01); H01L 25/18 (2023.01); H01L 25/00 (2006.01); G11C 7/08 (2006.01); G11C 7/10 (2006.01); G11C 11/408 (2006.01); G11C 11/4091 (2006.01); G16B 50/10 (2019.01); G16B 30/00 (2019.01); G06F 13/28 (2006.01);
U.S. Cl.
CPC ...
G11C 11/4093 (2013.01); G06F 3/0656 (2013.01); G06F 13/1673 (2013.01); G06F 13/28 (2013.01); G11C 7/08 (2013.01); G11C 7/1039 (2013.01); G11C 11/4087 (2013.01); G11C 11/4091 (2013.01); G11C 11/4096 (2013.01); G16B 30/00 (2019.02); G16B 50/10 (2019.02); H01L 21/78 (2013.01); H01L 22/12 (2013.01); H01L 24/08 (2013.01); H01L 24/48 (2013.01); H01L 24/80 (2013.01); H01L 25/0652 (2013.01); H01L 25/0657 (2013.01); H01L 25/18 (2013.01); H01L 25/50 (2013.01); G06F 2213/28 (2013.01); H01L 24/16 (2013.01); H01L 2224/0801 (2013.01); H01L 2224/08145 (2013.01); H01L 2224/1601 (2013.01); H01L 2224/16221 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48145 (2013.01); H01L 2224/48221 (2013.01); H01L 2224/80895 (2013.01); H01L 2224/80896 (2013.01); H01L 2225/06517 (2013.01); H01L 2225/06524 (2013.01); H01L 2225/06527 (2013.01); H01L 2225/06541 (2013.01); H01L 2225/06565 (2013.01); H01L 2225/06589 (2013.01); H01L 2924/1431 (2013.01); H01L 2924/1436 (2013.01); H01L 2924/14335 (2013.01);
Abstract
A wafer-on-wafer formed memory and logic device can enable high bandwidth transmission of data directly between a memory die and a logic die. A logic die that is bonded to a memory die via a wafer-on-wafer bonding process can receive signals indicative of a genetic sequence from the memory die and through a wafer-on-wafer bond. The logic die can also perform a genome annotation lotic operation to attach biological information to the genetic sequence. An annotated genetic sequence can be provided as an output.