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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11912910 B1

PDFFull Text
Date of Patent:
Feb. 27, 2024

Filed:

Mar. 25, 2021

Conductive film laminate and method of fabricating the same

Applicant:

Dongwoo Fine-chem Co., Ltd., Jeollabuk-do, KR;

Inventors:

Hyuk Hwan Kwon, Gyeonggi-do, KR;

Sun Kwon Ahn, Gyeonggi-do, KR;

Chang Yong Lee, Gyeonggi-do, KR;

Assignee:

DONGWOO FINE-CHEM CO., LTD., Jeollabuk-do, KR;

Attorney:

The PL Law Group, PLLC

Primary Examiner:

Patricia L Nordmeyer

Int. Cl.
CPC ...
C09J 9/02 (2006.01); H01B 5/14 (2006.01); C09J 7/40 (2018.01); G06F 3/044 (2006.01); B32B 7/06 (2019.01); B32B 7/12 (2006.01); B32B 38/00 (2006.01);
U.S. Cl.
CPC ...
C09J 9/02 (2013.01); B32B 7/06 (2013.01); B32B 7/12 (2013.01); B32B 38/0004 (2013.01); C09J 7/403 (2018.01); H01B 5/14 (2013.01); B32B 2307/202 (2013.01); C09J 2203/326 (2013.01); G06F 3/044 (2013.01);
Abstract

A conductive film laminate according to an embodiment of the present disclosure includes a carrier substrate, a conductive film liner on the carrier substrate, and a conductive adhesive film formed on the conductive film liner. The conductive film liner and the conductive adhesive film may form a cut pattern which does not cover the entire carrier substrate. The conductive adhesive film having a narrow width can be stably supplied on the carrier substrate. The conductive adhesive film may be used as an anisotropic conductive film for a bonding process of a touch sensor.

Find Patent Forward Citations

Kwon, Hyuk. (2024). Conductive film laminate and method of fabricating the same (U.S. Patent No. 11912910). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11912910

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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