The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 27, 2024

Filed:

Jan. 24, 2020
Applicant:

Applied Materials, Inc., Santa Clara, CA (US);

Inventors:

Jeonghoon Oh, Saratoga, CA (US);

Jamie Stuart Leighton, Palo Alto, CA (US);

Van H. Nguyen, Milpitas, CA (US);

Roger M. Johnson, Livermore, CA (US);

Assignee:

Applied Materials, Inc., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B24B 37/015 (2012.01); B24B 49/14 (2006.01); G05B 11/42 (2006.01); B24B 49/08 (2006.01); B24B 37/34 (2012.01); B24B 55/02 (2006.01);
U.S. Cl.
CPC ...
B24B 37/015 (2013.01); B24B 49/08 (2013.01); B24B 49/14 (2013.01); G05B 11/42 (2013.01); B24B 37/34 (2013.01); B24B 55/02 (2013.01);
Abstract

Embodiments of a system and method for polishing substrates are provided. In one embodiment, a polishing system is provided that includes a polishing module having a platen, and a platen temperature control system. The platen temperature control system includes a PID controller, a fluid controller, and a heat exchanger. The flow controller is configured to control an amount of fluid provided from the heat exchanger to a channels of the platen in response to instructions provided by the PID controller.


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