The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 27, 2024
Filed:
Dec. 14, 2019
Applicant:
Senju Metal Industry Co., Ltd., Tokyo, JP;
Inventors:
Yoshie Tachibana, Tokyo, JP;
Takeshi Sakamoto, Tokyo, JP;
Assignee:
Senju Metal Industry Co., Ltd., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 35/26 (2006.01); C22C 13/02 (2006.01);
U.S. Cl.
CPC ...
B23K 35/262 (2013.01); C22C 13/02 (2013.01);
Abstract
Provided is a solder alloy, a solder paste, a solder preform, and a solder joint which suppress chip cracking during cooling, improve the heat dissipation characteristics of the solder joint, and exhibit high joint strength at high temperatures. The solder alloy has an alloy composition of, by mass: Sb: 9.0 to 33.0%; Ag: more than 4.0% and less than 11.0%; and Cu: more than 2.0% and less than 6.0%, with the balance of Sn. Moreover, the solder paste, the solder preform, and the solder joint all contain said solder alloy.