The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 27, 2024
Filed:
Dec. 03, 2021
Entegris, Inc., Billerica, MA (US);
Thines Kumar Perumal, Singapore, SG;
Subhash Guddati, Singapore, SG;
Montray Leavy, Singapore, SG;
Virendra Warke, North Chelmsford, MA (US);
Devon N. Dion, Nashua, NH (US);
ENTEGRIS, INC., Billerica, MA (US);
Abstract
Three-dimensional multi-layer composite structures prepared by additive manufacturing techniques, as well as methods of preparing the structures by additive manufacturing techniques, wherein a multi-layer structure has layers of at least two different thicknesses and a precision thickness are disclosed herein. In some embodiments, a method includes forming a coarse feedstock layer having a coarse feedstock layer thickness, solidifying a portion of the coarse feedstock layer to form a solidified coarse feedstock layer having a solidified coarse feedstock layer thickness, before or after forming the solidified coarse feedstock layer, forming at least one fine feedstock layer having a fine feedstock layer thickness that is less than the coarse feedstock layer thickness, and solidifying a portion of the at least one fine feedstock layer to form the at least one solidified fine feedstock layer having a solidified fine feedstock layer thickness that is less than the solidified coarse feedstock layer thickness.