The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 20, 2024
Filed:
Mar. 04, 2021
Applicant:
Screen Holdings Co., Ltd., Kyoto, JP;
Inventors:
Dai Ueda, Kyoto, JP;
Yosuke Hanawa, Kyoto, JP;
Assignee:
SCREEN HOLDINGS CO., LTD., , JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/78 (2006.01); H01L 29/66 (2006.01); H01L 21/306 (2006.01); H01L 21/67 (2006.01); C23F 1/26 (2006.01); C23F 1/38 (2006.01); H01L 21/3213 (2006.01); C23F 1/32 (2006.01); H01L 21/28 (2006.01); H01L 29/49 (2006.01); H01L 21/8234 (2006.01);
U.S. Cl.
CPC ...
H01L 29/785 (2013.01); C23F 1/26 (2013.01); C23F 1/32 (2013.01); C23F 1/38 (2013.01); H01L 21/30604 (2013.01); H01L 21/32134 (2013.01); H01L 21/6708 (2013.01); H01L 21/67028 (2013.01); H01L 29/66795 (2013.01); H01L 21/28088 (2013.01); H01L 21/823437 (2013.01); H01L 29/4966 (2013.01);
Abstract
A substrate processing liquid is used to etch a substrate in which at least either a bottom wall or a side wall forming a trench structure is an etched layer made of metal or a metal compound. The substrate processing liquid includes a chemical liquid containing HOmolecules or HOfunctioning as an etchant for etching the metal, and a complex forming agent containing NHand forming a complex with ions of the metal and is adjusted to a pH of 5 or more.