The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 20, 2024
Filed:
May. 02, 2022
Applicant:
Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu, TW;
Inventors:
Jhih-Bin Chen, Hsinchu, TW;
Ming Chyi Liu, Hsinchu, TW;
Assignee:
Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/06 (2006.01); H01L 29/08 (2006.01); H01L 29/78 (2006.01);
U.S. Cl.
CPC ...
H01L 29/0653 (2013.01); H01L 29/0692 (2013.01); H01L 29/0873 (2013.01); H01L 29/7825 (2013.01);
Abstract
The present disclosure relates to a method of forming an integrated chip. The method includes forming a plurality of isolation structures within a substrate. The substrate is selectively etched to form a gate base recess within the substrate. The plurality of isolation structures are selectively etched to form a plurality of gate extension trenches extending outward from the gate base recess;