The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 20, 2024
Filed:
Sep. 19, 2022
Applicant:
Monolithic 3d Inc., Klamath Falls, OR (US);
Inventors:
Zvi Or-Bach, Haifa, IL;
Jin-Woo Han, San Jose, CA (US);
Brian Cronquist, Klamath Falls, OR (US);
Eli Lusky, Ramat-Gan, IL;
Assignee:
Monolithic 3D Inc., Klamath Falls, OR (US);
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 25/065 (2023.01); H01L 23/00 (2006.01); H01L 25/18 (2023.01);
U.S. Cl.
CPC ...
H01L 25/0657 (2013.01); H01L 24/08 (2013.01); H01L 25/18 (2013.01); H01L 2224/08145 (2013.01); H01L 2225/06544 (2013.01); H01L 2225/06565 (2013.01); H01L 2225/06589 (2013.01);
Abstract
A 3D device, the device including: at least a first level including logic circuits; and at least a second level bonded to the first level, where the second level includes a plurality of transistors, where the device include connectivity structures, where the connectivity structures include at least one of the following: a. differential signaling, or b. radio frequency transmission lines, or c. Surface Waves Interconnect (SWI) lines, and where the bonded includes oxide to oxide bond regions and metal to metal bond regions.