The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 20, 2024

Filed:

May. 24, 2021
Applicant:

Micron Technology, Inc., Boise, ID (US);

Inventors:

John F. Kaeding, Boise, ID (US);

Owen R. Fay, Meridian, ID (US);

Assignee:

Micron Technology, Inc., Boise, ID (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/66 (2006.01); H01Q 1/22 (2006.01); H01L 23/00 (2006.01); H01L 25/065 (2023.01); H01L 23/538 (2006.01); H10B 12/00 (2023.01);
U.S. Cl.
CPC ...
H01L 23/66 (2013.01); H01L 23/5384 (2013.01); H01L 24/09 (2013.01); H01L 25/0657 (2013.01); H01Q 1/2283 (2013.01); H10B 12/00 (2023.02); H01L 2223/6677 (2013.01); H01L 2224/02331 (2013.01); H01L 2224/02372 (2013.01);
Abstract

A system may include a first semiconductor substrate having a first side and a second side opposite the first side. The system may further include multiple device layers positioned on the first side of the substrate. The system may also include a first portion of an antenna structure positioned within at least one of the multiple device layers. The system may include a second portion of the antenna structure positioned over the second side of the substrate. The system may further include a via passing through the substrate and electrically coupling the first portion of the antenna structure to the second portion of the antenna structure.


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