The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 20, 2024

Filed:

Feb. 21, 2020
Applicant:

Amkor Technology Singapore Holding Pte. Ltd., Singapore, SG;

Inventors:

Sang Jae Jang, Seoul, KR;

Weilung Lu, Chandler, AZ (US);

Burt Barber, Phoenix, AZ (US);

Adrian Arcedera, Chandler, AZ (US);

Shingo Nakamura, Kanagawa, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/043 (2006.01); H01L 21/52 (2006.01); H01L 23/06 (2006.01); H01L 23/31 (2006.01); H01L 21/50 (2006.01); H01L 23/04 (2006.01); H01L 23/10 (2006.01); H01L 23/16 (2006.01); H01L 23/055 (2006.01); H01L 23/498 (2006.01);
U.S. Cl.
CPC ...
H01L 23/043 (2013.01); H01L 21/50 (2013.01); H01L 21/52 (2013.01); H01L 23/04 (2013.01); H01L 23/055 (2013.01); H01L 23/06 (2013.01); H01L 23/10 (2013.01); H01L 23/16 (2013.01); H01L 23/3128 (2013.01); H01L 23/3135 (2013.01); H01L 23/3157 (2013.01); H01L 23/49838 (2013.01);
Abstract

In one example, a semiconductor device comprises a substrate comprising a top side, a bottom side, and a conductive structure, a body over the top side of the substrate, an electronic component over the top side of the substrate and adjacent to the body, wherein the electronic component comprises an interface element on a top side of the electronic component, a lid over the interface element and a seal between the top side of the electronic component and the lid, and a buffer on the top side of the substrate between the electronic component and the body. Other examples and related methods are also disclosed herein.


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