The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 13, 2024
Filed:
Sep. 28, 2022
Ibiden Co., Ltd., Gifu, JP;
Shigeto Iyoda, Ogaki, JP;
IBIDEN CO., LTD., Ogaki, JP;
Abstract
A wiring substrate includes an insulating layer, a conductor layer formed on a surface of the insulating layer such that the conductor layer includes a conductor pad, and a solder resist layer formed on the surface of the insulating layer such that the solder resist layer is covering the conductor layer and having an opening exposing the conductor pad. The conductor pad of the conductor layer has a substantially rectangular planar shape such that the conductor pads has a main surface, a pair of long sides, a pair of short sides and four corner portions, and the solder resist layer is formed such that the opening is exposing side surfaces at the long sides and 50% or more of the main surface and that the solder resist layer is covering side surfaces at the short sides.