The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 13, 2024
Filed:
Aug. 03, 2020
Applicant:
Mitsubishi Materials Corporation, Tokyo, JP;
Inventors:
Yoshie Tarutani, Naka, JP;
Kenji Kubota, Naka, JP;
Assignee:
MITSUBISHI MATERIALS CORPORATION, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01R 13/03 (2006.01); B32B 15/01 (2006.01); C25D 3/64 (2006.01); C22C 5/06 (2006.01); C25D 3/12 (2006.01); C25D 3/46 (2006.01); C25D 5/12 (2006.01);
U.S. Cl.
CPC ...
H01R 13/03 (2013.01); B32B 15/01 (2013.01); C22C 5/06 (2013.01); C25D 3/12 (2013.01); C25D 3/46 (2013.01); C25D 3/64 (2013.01); C25D 5/12 (2013.01); B32B 2307/732 (2013.01); B32B 2457/00 (2013.01);
Abstract
Providing a terminal material for connectors provided with a base material in which at least a surface layer is made of copper or copper alloy, a nickel-plating layer made of nickel or nickel alloy coating a surface of the base material, and a silver-nickel alloy plating layer formed on at least a part of the nickel-plating layer, the silver-nickel alloy plating layer having a film thickness of 0.5 μm to 20 μm inclusive, a nickel content of 0.03 at % to 1.20 at % inclusive, and an average crystal grain size of 10 nm to 150 nm inclusive, to improve abrasion resistance and heat resistance.