The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 13, 2024

Filed:

Sep. 01, 2021
Applicant:

Taiwan Semiconductor Manufacturing Company Limited, Hsin-Chu, TW;

Inventors:

Kai-Hung Hsiao, Kaohsiung, TW;

Chi-Chung Jen, Kaohsiung, TW;

Yu-Chun Shen, Tainan, TW;

Jhang-Jie Jian, Tainan, TW;

Wen-Chih Chiang, Hsinchu, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/677 (2006.01); H05F 3/00 (2006.01); H01L 21/673 (2006.01); B25J 11/00 (2006.01);
U.S. Cl.
CPC ...
H01L 21/67733 (2013.01); H01L 21/6732 (2013.01); H05F 3/00 (2013.01); B25J 11/0095 (2013.01);
Abstract

A semiconductor wafer processing system includes a stocker having an interior surface, a wafer carrier disposed within the stocker, a wafer shelf disposed within the wafer carrier for storing a semiconductor wafer, and a discharge circuit including a first conductor electrically coupled to the wafer shelf and a first current controller electrically coupled to the first conductor and to the interior surface of the stocker.


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