The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 13, 2024
Filed:
Jan. 22, 2020
Dowa Metaltech Co., Ltd., Tokyo, JP;
DOWA METALTECH CO., LTD., Tokyo, JP;
Abstract
There is provided an inexpensive plated product, which can prevent the increase of the contact resistance of a silver-plating film and the change of the color of the surface thereof after reflow-treating a plated product wherein the silver-plating film is formed on a portion of the surface thereof and wherein a tin-plating film is formed on a portion of the other portion of the surface thereof, and a method for producing the same. The plated product is produced by a method including the steps of: forming a nickel-plating filmon a surface of a base materialof copper or a copper alloy; forming a silver-plating filmon a portion of a surface of the nickel-plating film, and forming a tin-plating filmon a portion of the other portion of the surface of the nickel-plating film, to prepare a plated product which has the silver-plating filmand the tin-plating filmon the surface of the nickel-plating filmformed on the base material; and irradiating the surface of the plated product with infrared rays to heat the surface thereof to reflow-treat the tin-plating filmto cause the tin-plating filmto be a reflowed tin-plating layer