The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 06, 2024

Filed:

Apr. 10, 2023
Applicant:

Qualcomm Incorporated, San Diego, CA (US);

Inventors:

Jonghae Kim, San Diego, CA (US);

Milind Shah, San Diego, CA (US);

Periannan Chidambaram, San Diego, CA (US);

Assignee:

QUALCOMM Incorporated, San Diego, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/08 (2006.01); H01L 23/64 (2006.01); H01L 25/065 (2023.01); H01L 25/10 (2006.01); H01L 49/02 (2006.01); H01L 29/94 (2006.01); H01L 29/66 (2006.01); H10B 12/00 (2023.01);
U.S. Cl.
CPC ...
H01L 27/0805 (2013.01); H01L 23/642 (2013.01); H01L 25/0657 (2013.01); H01L 25/105 (2013.01); H01L 28/40 (2013.01); H01L 28/90 (2013.01); H01L 29/66181 (2013.01); H01L 29/945 (2013.01); H10B 12/038 (2023.02); H10B 12/37 (2023.02); H10B 12/39 (2023.02); H01L 2924/19041 (2013.01);
Abstract

Certain aspects of the present disclosure provide a capacitor assembly, a stacked capacitor assembly, an integrated circuit (IC) assembly comprising such a stacked capacitor assembly, and methods for fabricating the same. One exemplary capacitor assembly generally includes a first array of trench capacitors and a second array of trench capacitors. The second array of trench capacitors may be disposed adjacent to and electrically coupled to the first array of trench capacitors. Additionally, the second array of trench capacitors may be inverted with respect to the first array of trench capacitors.


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