The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 06, 2024
Filed:
May. 28, 2021
Applicant:
Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;
Inventors:
Wei-Hung Lin, Xinfeng Township, TW;
Hsiu-Jen Lin, Zhubei, TW;
Ming-Da Cheng, Taoyuan, TW;
Yu-Min Liang, Zhongli, TW;
Chen-Shien Chen, Zhubei, TW;
Chung-Shi Liu, Hsinchu, TW;
Assignee:
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED, Hsinchu, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 24/17 (2013.01); H01L 24/14 (2013.01); H01L 24/16 (2013.01); H01L 24/13 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/131 (2013.01); H01L 2224/13005 (2013.01); H01L 2224/13082 (2013.01); H01L 2224/1403 (2013.01); H01L 2224/16013 (2013.01); H01L 2224/16104 (2013.01); H01L 2224/16238 (2013.01); H01L 2224/1701 (2013.01); H01L 2224/1703 (2013.01); H01L 2224/17104 (2013.01);
Abstract
According to an exemplary embodiment, a substrate having a first area and a second area is provided. The substrate includes a plurality of pads. Each of the pads has a pad size. The pad size in the first area is larger than the pad size in the second area.