The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 06, 2024
Filed:
Jul. 29, 2021
Applicant:
Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;
Inventor:
I-Che Lee, Hsinchu, TW;
Assignee:
Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/522 (2006.01); H01L 49/02 (2006.01); H01L 27/08 (2006.01);
U.S. Cl.
CPC ...
H01L 23/5223 (2013.01); H01L 27/0805 (2013.01); H01L 28/60 (2013.01);
Abstract
Disclosed are metal-insulator-metal capacitors and integrated chips. In one embodiment, a metal-insulator-metal capacitor includes N electrodes and (N−1) passivation layers, wherein the N electrodes and the (N−1) passivation layers are alternately stacked on a substrate. N is an integer larger than 1. Thicknesses of the N electrodes gradually increase in a direction parallel to a normal direction of the substrate.