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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11894257 B1

PDFFull Text
Date of Patent:
Feb. 06, 2024

Filed:

Oct. 26, 2018

Single wafer processing environments with spatial separation

Applicant:

Applied Materials, Inc., Santa Clara, CA (US);

Inventors:

Michael Rice, Pleasanton, CA (US);

Joseph AuBuchon, San Jose, CA (US);

Sanjeev Baluja, Campbell, CA (US);

Mandyam Sriram, San Jose, CA (US);

Assignee:

Applied Materials, Inc., Santa Clara, CA (US);

Attorney:

Servilla Whitney LLC

Primary Examiner:

Keath T Chen

Int. Cl.
CPC ...
H01L 21/68 (2006.01); H01L 21/687 (2006.01); C23C 16/44 (2006.01); C23C 16/458 (2006.01); H01L 21/67 (2006.01); C23C 16/46 (2006.01); H01L 21/683 (2006.01); C23C 16/455 (2006.01);
U.S. Cl.
CPC ...
H01L 21/68785 (2013.01); C23C 16/4409 (2013.01); C23C 16/4584 (2013.01); C23C 16/45525 (2013.01); C23C 16/46 (2013.01); H01L 21/6719 (2013.01); H01L 21/67103 (2013.01); H01L 21/67248 (2013.01); H01L 21/6831 (2013.01); H01L 21/6833 (2013.01); H01L 21/68764 (2013.01); H01L 21/68771 (2013.01);
Abstract

Apparatus and methods to process one or more wafers are described. A plurality of process stations are arranged in a circular configuration around a rotational axis. A support assembly with a rotatable center base defining a rotational axis, at least two support arms extending from the center base and heaters on each of the support arms is positioned adjacent the processing stations so that the heaters can be moved amongst the various process stations to perform one or more process condition.

Find Patent Forward Citations

Rice, Michael. (2024). Single wafer processing environments with spatial separation (U.S. Patent No. 11894257). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11894257

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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