The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 06, 2024

Filed:

Oct. 27, 2021
Applicant:

Samsung Electro-mechanics Co., Ltd., Suwon-si, KR;

Inventors:

Tae Hyeong Kim, Suwon-si, KR;

Moon Soo Park, Suwon-si, KR;

Ji Hyun Yu, Suwon-si, KR;

Jin Woo Jang, Suwon-si, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01G 4/30 (2006.01); H01G 4/12 (2006.01); H01G 4/232 (2006.01); H01G 4/012 (2006.01);
U.S. Cl.
CPC ...
H01G 4/1227 (2013.01); H01G 4/30 (2013.01); H01G 4/012 (2013.01); H01G 4/232 (2013.01);
Abstract

A multilayer electronic component includes a body including a plurality of first dielectric layers, an active portion in which internal electrodes are alternately disposed, and a cover portion disposed the active portion in a first direction of the body, a direction in which the plurality of first dielectric layers are laminated, and including a second dielectric layer; and an external electrode disposed externally on the body and connected to one of the internal electrodes. The body includes a margin portion covering a side surface of the one of the internal electrodes other than a side surface connected to the external electrode and including a dielectric pattern having a porosity higher than that of one of the plurality of first dielectric layers.


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