The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 06, 2024
Filed:
Apr. 16, 2021
Applicant:
Disco Corporation, Tokyo, JP;
Inventor:
Xiaoming Qiu, Tokyo, JP;
Assignee:
DISCO CORPORATION, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B28D 5/00 (2006.01); B23K 26/53 (2014.01); B23K 103/00 (2006.01); B23K 101/40 (2006.01); H01L 29/16 (2006.01);
U.S. Cl.
CPC ...
B28D 5/0011 (2013.01); B23K 26/53 (2015.10); B28D 5/0076 (2013.01); B23K 2101/40 (2018.08); B23K 2103/52 (2018.08); B28D 5/0094 (2013.01); H01L 29/1608 (2013.01);
Abstract
A production method of a wafer includes a wafer production step in which ultrasonic water is ejected against an end face of an ingot with cleavage layers created therein, thereby severing the wafer from a rest of the ingot to produce the wafer.