The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 30, 2024

Filed:

Apr. 17, 2020
Applicant:

Wolfspeed, Inc., Durham, NC (US);

Inventors:

Mrinal K. Das, Morrisville, NC (US);

Adam Barkley, Durham, NC (US);

Henry Lin, Chapel Hill, NC (US);

Marcelo Schupbach, Raleigh, NC (US);

Assignee:

Wolfspeed, Inc., Durham, NC (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H02M 3/155 (2006.01); H02M 3/00 (2006.01); H01L 25/07 (2006.01); H01L 23/373 (2006.01); H01L 29/16 (2006.01); H05K 3/30 (2006.01); H02M 1/44 (2007.01); H02M 1/00 (2006.01); H02M 1/34 (2007.01); H02M 1/08 (2006.01); H02M 7/00 (2006.01);
U.S. Cl.
CPC ...
H02M 3/155 (2013.01); H01L 23/3735 (2013.01); H01L 25/072 (2013.01); H01L 29/1608 (2013.01); H02M 3/003 (2021.05); H05K 3/303 (2013.01); B60L 2210/00 (2013.01); H01L 2224/0603 (2013.01); H01L 2224/4903 (2013.01); H01L 2224/49111 (2013.01); H01L 2224/49431 (2013.01); H02M 1/0054 (2021.05); H02M 1/08 (2013.01); H02M 1/348 (2021.05); H02M 1/44 (2013.01); H02M 7/003 (2013.01); Y02B 70/10 (2013.01);
Abstract

A power converter module includes an active metal braze (AMB) substrate, power converter circuitry, and a housing. The AMB substrate includes an aluminum nitride base layer, a first conductive layer on a first surface of the aluminum nitride base layer, and a second conductive layer on a second surface of the aluminum nitride base layer opposite the first surface. The power converter circuitry includes a number of silicon carbide switching components coupled to one another via the first conductive layer. The housing is over the power converter circuitry and the AMB substrate. By using an AMB substrate with an aluminum nitride base layer, the thermal dissipation characteristics of the power converter module may be substantially improved while maintaining the structural integrity of the power converter module.


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