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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11888210 B1

PDFFull Text
Date of Patent:
Jan. 30, 2024

Filed:

Aug. 06, 2021

Electronic package and method of manufacturing the same

Applicant:

Advanced Semiconductor Engineering, Inc., Kaohsiung, TW;

Inventors:

Jenchun Chen, Kaohsiung, TW;

Ya-Wen Liao, Kaohsiung, TW;

Assignee:

ADVANCED SEMICONDUCTOR ENGINEERING, INC., Kaohsiung, TW;

Attorney:

FOLEY & LARDNER LLP

Primary Examiner:

Robert Karacsony

Int. Cl.
CPC ...
H01Q 1/22 (2006.01); H01L 23/66 (2006.01); H01Q 1/42 (2006.01); H01Q 1/40 (2006.01); H01Q 21/06 (2006.01); H01Q 21/08 (2006.01); H01Q 9/04 (2006.01);
U.S. Cl.
CPC ...
H01Q 1/2283 (2013.01); H01L 23/66 (2013.01); H01Q 1/40 (2013.01); H01Q 1/422 (2013.01); H01Q 9/0414 (2013.01); H01Q 21/065 (2013.01); H01Q 21/08 (2013.01); H01L 2223/6677 (2013.01); H01L 2223/6688 (2013.01);
Abstract

The present disclosure provides an electronic package. The electronic package includes an antenna structure having a first antenna and a second antenna at least partially covered by the first antenna. The electronic package also includes a directing element covering the antenna structure. The directing element has a first portion configured to direct a first electromagnetic wave having a first frequency to transmit via the first antenna and a second portion configured to direct a second electromagnetic wave having a second frequency different from the first frequency to transmit via the second antenna. A method of manufacturing an electronic package is also provided.

Find Patent Forward Citations

Chen, Jenchun. (2024). Electronic package and method of manufacturing the same (U.S. Patent No. 11888210). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11888210

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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