The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 30, 2024

Filed:

Mar. 05, 2019
Applicant:

Hitachi Energy Ltd, Zurich, CH;

Inventors:

Andrei Mihaila, Rieden, CH;

Lars Knoll, Hägglingen, CH;

Lukas Kranz, Zürich, CH;

Assignee:

Hitachi Energy Ltd, Zurich, CH;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/06 (2006.01); H01L 29/40 (2006.01); H01L 29/16 (2006.01); H01L 29/20 (2006.01); H01L 29/66 (2006.01); H01L 29/861 (2006.01); H01L 29/872 (2006.01);
U.S. Cl.
CPC ...
H01L 29/407 (2013.01); H01L 29/0649 (2013.01); H01L 29/0661 (2013.01); H01L 29/1608 (2013.01); H01L 29/2003 (2013.01); H01L 29/6606 (2013.01); H01L 29/66143 (2013.01); H01L 29/8613 (2013.01); H01L 29/872 (2013.01);
Abstract

A power semiconductor device includes a wide-bandgap semiconductor layer having an active region and a termination region that laterally surrounds the active region. The wide-bandgap semiconductor layer has a first recess that is recessed from the first main side in the termination region and surrounds the active region and a second recess that is recessed from the first main side in the active region and is filled with an insulating material. A depth of the second recess is the same as a depth of the first recess. A field plate on the first main side of the wide-bandgap semiconductor layer exposes a first portion of the wide-bandgap semiconductor layer in the termination region.


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