The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 30, 2024

Filed:

Jun. 12, 2020
Applicant:

Applied Materials, Inc., Santa Clara, CA (US);

Inventors:

Shreesha Yogish Rao, Milpitas, CA (US);

Mukund Sundararajan, Bangalore, IN;

Cheng-Hsiung Matthew Tsai, Cupertino, CA (US);

Manjunatha P. Koppa, Bengaluru, IN;

Steven V. Sansoni, Livermore, CA (US);

Assignee:

APPLIED MATERIALS, INC., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/683 (2006.01); H01J 37/32 (2006.01);
U.S. Cl.
CPC ...
H01L 21/6833 (2013.01); H01J 37/32724 (2013.01); H01J 2237/002 (2013.01); H01J 2237/334 (2013.01);
Abstract

Embodiments of a substrate support are provided herein. In some embodiments, a substrate support for use in a substrate processing chamber includes a lower assembly having a base plate assembly, wherein the base plate assembly includes a plurality of electrical feedthroughs disposed about a central protrusion; a ceramic puck disposed on the lower assembly and removeably coupled to the base plate assembly, wherein the ceramic puck has an electrode disposed therein that is electrically coupled to first pair of electrical feedthroughs of the plurality of electrical feedthroughs; and a flexible connector having a spiral portion disposed between the ceramic puck and each of the plurality of electrical feedthroughs to allow for differences in thermal expansion of the ceramic puck and the base plate assembly.


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