The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 30, 2024
Filed:
Oct. 30, 2020
Applicant:
Advanced Semiconductor Engineering, Inc., Kaohsiung, TW;
Inventor:
Chenghan She, Kaohsiung, TW;
Assignee:
ADVANCED SEMICONDUCTOR ENGINEERING, INC., Kaohsiung, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/56 (2006.01); B29C 43/34 (2006.01); B29C 43/08 (2006.01); H01L 21/67 (2006.01); B29C 43/18 (2006.01); B29L 31/34 (2006.01); B29K 105/00 (2006.01);
U.S. Cl.
CPC ...
H01L 21/565 (2013.01); B29C 43/18 (2013.01); B29C 43/34 (2013.01); H01L 21/568 (2013.01); H01L 21/67126 (2013.01); B29C 2043/3438 (2013.01); B29K 2105/251 (2013.01); B29L 2031/3406 (2013.01);
Abstract
A method and a system for manufacturing a semiconductor package structure are provided. The method includes: (a) measuring an amount of a molding powder; (b) controlling the amount of a molding powder; and (c) dispensing the molding powder on an assembly structure including a carrier and at least one semiconductor device disposed on the carrier.