The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 30, 2024
Filed:
Jun. 26, 2023
Fujikoshi Machinery Corp., Nagano, JP;
Masashi Maruta, Nagano, JP;
Fujikoshi Machinery Corp., Nagano, JP;
Abstract
A double-sided polishing apparatus includes: a lower surface plate; an upper surface plate; and a carrier disposed between the lower surface plate and the upper surface plate and holding a disk-shaped workpiece, wherein the carrier is configured to rotate about a center of the lower surface plate and the upper surface plate and to rotate about a center of the carrier, the double-sided polishing apparatus includes a thickness measuring sensor at a fixed position above the upper surface plate or below the lower surface plate or at a movable position in an upper portion of the upper surface plate or a lower portion of the lower surface plate, the carrier includes circular perforations each holding the workpiece at a position eccentric to the center of the carrier, when a central position of any of the perforations preset by a user is defined as a first reference position, with a distance between a center of the upper surface plate or the lower surface plate and a center of any of the perforations preset by the user being shortest or longest, and a position apart from the first reference position by half of a first distance in a direction of the center of the carrier is defined as a second reference position, with the first distance being a predetermined length within 30% of a radius of the perforation, then the thickness measuring sensor is provided in a range of the first distance about the second reference position in a plan view, and the thickness measuring sensor is configured to measure a thickness of the workpiece in a state in which the workpiece is held in the perforation, through a measuring hole provided on the upper surface plate or the lower surface plate closer to a side on which the thickness measuring sensor is disposed.