The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 23, 2024

Filed:

Mar. 05, 2020
Applicant:

Sumitomo Electric Industries, Ltd., Osaka, JP;

Inventor:

Hisato Michikoshi, Osaka, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/739 (2006.01); H01L 23/367 (2006.01); H01L 23/40 (2006.01); H01L 25/07 (2006.01);
U.S. Cl.
CPC ...
H01L 29/7395 (2013.01); H01L 23/3672 (2013.01); H01L 23/40 (2013.01); H01L 25/072 (2013.01);
Abstract

A semiconductor device includes: a first semiconductor chip having first and second electrodes on a first surface and having a third electrode on a second surface; a second semiconductor chip having first and second electrodes on a first surface and having a third electrode on a second surface; a first electrode plate bonded to the second electrode of the first semiconductor chip; a second electrode plate bonded to the third electrode of the second semiconductor chip; and a third electrode plate having a first area sandwiched between the first and second semiconductor chips and a second area not sandwiched between the first and second semiconductor chips, one surface of the first area is bonded to the second electrode of the second semiconductor chip, and another surface is bonded to the third electrode of the first semiconductor chip, and the first area is thinner than the second area.


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