The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 23, 2024

Filed:

Apr. 26, 2018
Applicant:

Orbotech Ltd., Yavne, IL;

Inventors:

Michael Zenou, Hashmonaim, IL;

Zvi Kotler, Tel Aviv, IL;

Ofer Fogel, Jerusalem, IL;

Assignee:

ORBOTECH LTD., Yavne, IL;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 21/48 (2006.01);
U.S. Cl.
CPC ...
H01L 24/19 (2013.01); H01L 21/4846 (2013.01); H01L 24/73 (2013.01); H01L 24/76 (2013.01); H01L 24/82 (2013.01); H01L 24/83 (2013.01); H01L 2224/73259 (2013.01); H01L 2224/76158 (2013.01); H01L 2224/82103 (2013.01);
Abstract

A method for producing electronic devices includes fixing a die that includes an electronic component with integral contacts to a dielectric substrate. After fixing the die, a conductive trace is printed over both the dielectric substrate and at least one of the integral contacts, so as to create an ohmic connection between the conductive trace on the substrate and the electronic component.


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