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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11881418 B1

PDFFull Text
Date of Patent:
Jan. 23, 2024

Filed:

Jun. 04, 2021

Wafer cleaning apparatus

Applicant:

Disco Corporation, Tokyo, JP;

Inventors:

Shohei Takeda, Tokyo, JP;

Tomohisa Ishikawa, Tokyo, JP;

Tsunaki Sakai, Tokyo, JP;

Assignee:

DISCO CORPORATION, Tokyo, JP;

Attorney:

GREER BURNS & CRAIN, LTD.

Primary Examiner:

Benjamin L Osterhout

Int. Cl.
CPC ...
H01L 21/06 (2006.01); H01L 21/687 (2006.01); B08B 3/02 (2006.01); B08B 13/00 (2006.01); H01L 21/67 (2006.01); H01L 21/02 (2006.01);
U.S. Cl.
CPC ...
H01L 21/67051 (2013.01); B08B 3/022 (2013.01); B08B 13/00 (2013.01); H01L 21/68764 (2013.01); H01L 21/02087 (2013.01);
Abstract

A wafer cleaning apparatus for cleaning a circumferential edge of a wafer includes a cleaning unit that jets water toward the circumferential edge of the wafer from an outer side of the circumferential edge of the wafer held by a holding surface of a holding table, to clean the circumferential edge of the wafer. The cleaning unit includes a first nozzle that jets the water to the circumferential edge of the wafer from an outer side of the circumferential edge of the wafer in a direction parallel to the holding surface, a second nozzle that jets the water to the circumferential edge of the wafer in a direction of 45 degrees downward relative to the holding surface, and a third nozzle that jets the water to the circumferential edge of the wafer in a direction of 45 degrees upward relative to the holding surface.

Find Patent Forward Citations

Takeda, Shohei. (2024). Wafer cleaning apparatus (U.S. Patent No. 11881418). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11881418

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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