The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 23, 2024

Filed:

Jul. 28, 2020
Applicant:

Paul Scherrer Institut, Villigen PSI, CH;

Inventors:

Lucia Romano, Dottikon, CH;

Konstantins Jefimovs, Tegerfelden, CH;

Matias Kagias, Zurich, CH;

Joan Vila Comamala, Ennetbaden, CH;

Marco Stampanoni, Endingen, CH;

Assignee:

Paul Scherrer Institut, Villigen PSI, CH;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/306 (2006.01); H01L 21/308 (2006.01); H01L 31/028 (2006.01); B81C 1/00 (2006.01); G02B 5/18 (2006.01); B82Y 20/00 (2011.01); B82Y 40/00 (2011.01); H01L 31/18 (2006.01); C09K 13/08 (2006.01);
U.S. Cl.
CPC ...
H01L 21/30604 (2013.01); B81C 1/00619 (2013.01); G02B 5/1857 (2013.01); H01L 21/308 (2013.01); H01L 21/3085 (2013.01); H01L 21/3086 (2013.01); H01L 31/028 (2013.01); B82Y 20/00 (2013.01); B82Y 40/00 (2013.01); C09K 13/08 (2013.01); G02B 5/1838 (2013.01); H01L 31/1804 (2013.01); Y02P 70/50 (2015.11);
Abstract

Elements of photonic devices with high aspect ratio patterns are fabricated. A stabilizing catalyst that forms a stable metal-semiconductor alloy allows to etch a substrate in vertical direction even at very low oxidant concentration without external bias or magnetic field. A metal layer on the substrate reacts with the oxidant contained in air and catalyzes the semiconductor etching by the etchant. Air in continuous flow at the metal layer allows to maintain constant the oxidant concentration in proximity of the metal layer. The process can continue for a long time in order to form very high aspect ratio structures in the order of 10,000:1. Once the etched semiconductor structure is formed, the continuous air flow supports the reactant species diffusing through the etched semiconductor structure to maintain a uniform etching rate. The continuous air flow supports the diffusion of reaction by-products to avoid poisoning of the etching reaction.


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