The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 23, 2024

Filed:

Jun. 13, 2023
Applicant:

Jiangnan University, Wuxi, CN;

Inventors:

Li Cheng, Wuxi, CN;

Junnan Jin, Wuxi, CN;

Zhengbiao Gu, Wuxi, CN;

Zhaofeng Li, Wuxi, CN;

Yan Hong, Wuxi, CN;

Caiming Li, Wuxi, CN;

Xiaofeng Ban, Wuxi, CN;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C09J 103/02 (2006.01); C09J 11/04 (2006.01); C09J 11/06 (2006.01); B32B 7/12 (2006.01); B32B 37/12 (2006.01);
U.S. Cl.
CPC ...
C09J 103/02 (2013.01); C09J 11/04 (2013.01); C09J 11/06 (2013.01); B32B 7/12 (2013.01); B32B 37/12 (2013.01); C09J 2203/346 (2020.08); C09J 2301/50 (2020.08);
Abstract

The present disclosure discloses a low-viscosity thermosetting starch adhesive for particleboards, and a preparation method therefore, belonging to the technical field of adhesive preparation. The adhesive of the present invention selects N-hydroxyethyl acrylamide or acetoxyethyl methacrylate as the crosslinking monomer, which has a low degree of crosslinking in the process of adhesive preparation to avoid the problem of increasing viscosity, but can cross-link quickly during the hot pressing process, forming a network structure, and improving the water resistance of the adhesive; and furthermore, itaconic acid is added to promote the self-crosslinking reaction of the crosslinking monomer in the hot-pressing process, thus further improving the water resistance. The properties of the manufactured particleboards reach the standard of P2 type particleboards, so that the adhesive can be suitable for mass production and can be widely applied in the preparation of wood decoration, particleboards, plywood and fiberboard.


Find Patent Forward Citations

Loading…