The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 23, 2024
Filed:
Aug. 23, 2021
Applicant:
Disco Corporation, Tokyo, JP;
Inventor:
Satoshi Yamanaka, Tokyo, JP;
Assignee:
DISCO CORPORATION, Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B24B 37/04 (2012.01); H01L 21/02 (2006.01);
U.S. Cl.
CPC ...
B24B 37/042 (2013.01); H01L 21/02021 (2013.01);
Abstract
An as-sliced wafer processing method includes a grinding step of grinding a first surface of an as-sliced wafer, an outer periphery positioning step of moving a chuck table and a grinding unit relative to each other in directions parallel to a holding surface of the chuck table so as to position an edge on an outer periphery of grinding stones at an outer peripheral edge of the first surface after the grinding step is carried out, and a chamfering step of chamfering an outer periphery of the first surface of the as-sliced wafer by the grinding stones after the outer periphery positioning step is carried out.