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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11876040 B1

PDFFull Text
Date of Patent:
Jan. 16, 2024

Filed:

May. 25, 2021

Semiconductor devices and methods of manufacturing semiconductor devices

Applicant:

Amkor Technology Singapore Holding Pte. Ltd., Singapore, SG;

Inventors:

Sang Hyun Jin, Incheon, KR;

Young Jin Kang, Gwangju, KR;

Jin Suk Jeong, Incheon, KR;

Yun Kyung Jeong, Incheon, KR;

Assignee:

Amkor Technology Singapore Holding Pte. Ltd., Singapore, SG;

Attorney:

Spectrum IP Law Group LLC

Primary Examiner:

Selim U Ahmed

Assistant Examiner:

Evan G Clinton

Int. Cl.
CPC ...
H01L 23/498 (2006.01); H01L 21/48 (2006.01); H01L 23/31 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49822 (2013.01); H01L 21/481 (2013.01); H01L 21/4857 (2013.01); H01L 23/49838 (2013.01); H01L 23/3128 (2013.01); H01L 24/16 (2013.01); H01L 2224/16227 (2013.01);
Abstract

In one example, an electronic device, comprises a substrate, comprising a first dielectric having a top surface and a bottom surface, and a first conductor in the first dielectric and comprising a first via and a first trace over the first via. The first trace comprises a first trace sidewall and a first trace base, and the first via comprises a first via sidewall. The first conductor comprises a first arcuate vertex between the first trace sidewall and the first trace base, and a second arcuate vertex between the first via sidewall and the first trace base, an electronic component over the top surface of the substrate, and an encapsulant over the top surface of the substrate and contacting a lateral side of the electronic component. Other examples and related methods are also disclosed herein.

Find Patent Forward Citations

Jin, Sang. (2024). Semiconductor devices and methods of manufacturing semiconductor devices (U.S. Patent No. 11876040). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11876040

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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