The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 16, 2024

Filed:

Nov. 03, 2021
Applicant:

Mpi Corporation, Hsinchu County, TW;

Inventors:

Chin-Yi Lin, Hsinchu County, TW;

Che-Wei Lin, Hsinchu County, TW;

Ting-Ju Wu, Hsinchu County, TW;

Chien-Kai Hung, Hsinchu County, TW;

Assignee:

MPI CORPORATION, Hsinchu County, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01R 3/00 (2006.01); G01R 1/073 (2006.01);
U.S. Cl.
CPC ...
G01R 3/00 (2013.01); G01R 1/07342 (2013.01);
Abstract

A probe card and a manufacturing method of a probe card are provided. The probe card includes a probe head, first and second substrates, a first elastic component, and a first adhesive member. The second substrate is disposed between the probe head and the first substrate, and is disposed on the first substrate. The second substrate faces the first substrate and includes second contacts. The second contacts are electrically connected to first contacts of the first substrate. The first elastic component is disposed between the first substrate and the second substrate, and disposed at an outer side of the second contacts. The first adhesive member is disposed on the first substrate, annularly arranged on the side surface of the second substrate, and disposed at an outer side of the first elastic component.


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