The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 09, 2024
Filed:
Feb. 17, 2021
Applicant:
Wolfspeed, Inc., Durham, NC (US);
Inventors:
Daniel Jenner Lichtenwalner, Raleigh, NC (US);
Edward Robert Van Brunt, Raleigh, NC (US);
Thomas E. Harrington, III, Carrollton, TX (US);
Shadi Sabri, Apex, NC (US);
Brett Hull, Raleigh, NC (US);
Brice McPherson, Fayetteville, AR (US);
Joe W. McPherson, Plano, TX (US);
Assignee:
Wolfspeed, Inc., Durham, NC (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/40 (2006.01); H01L 29/16 (2006.01);
U.S. Cl.
CPC ...
H01L 29/404 (2013.01); H01L 29/1608 (2013.01);
Abstract
Strategic placement and patterning of electrodes, vias, and metal runners can significantly reduce strain in a power semiconductor die. By modifying the path defining electrodes, vias, and metal runners, as well as patterning the material layers thereof, strain can be better managed to increase reliability of a power semiconductor die.