The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 09, 2024
Filed:
Dec. 14, 2020
Applicant:
Advanced Micro Devices, Inc., Santa Clara, CA (US);
Inventors:
John Wuu, Fort Collins, CO (US);
David Johnson, Fort Collins, CO (US);
Assignee:
Advanced Micro Devices, Inc., Santa Clara, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 25/065 (2023.01); H01L 25/18 (2023.01); H01L 23/00 (2006.01); H02M 3/04 (2006.01); H03K 19/20 (2006.01);
U.S. Cl.
CPC ...
H01L 25/0657 (2013.01); H01L 24/08 (2013.01); H01L 25/18 (2013.01); H02M 3/04 (2013.01); H03K 19/20 (2013.01); H01L 2224/08146 (2013.01); H01L 2225/06517 (2013.01); H01L 2225/06541 (2013.01); H01L 2225/06565 (2013.01);
Abstract
A stacked die system includes at least three dies. A first die has a same design as a second die. The first die includes a first circuit, and the second die includes a corresponding second circuit. A signal is received at the first die and sent to the third die via the second die. The signal is routed through either the first circuit or the second circuit but not both. Accordingly, an operation is performed on the signal prior to the signal reaching the third die but the operation is not performed by both the first circuit and the second circuit.