The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 09, 2024
Filed:
May. 11, 2021
Applicant:
Texas Instruments Incorporated, Dallas, TX (US);
Inventors:
Woochan Kim, Sunnyvale, CA (US);
Benjamin Allen Samples, Albany, OR (US);
Vivek Kishorechand Arora, San Jose, CA (US);
Assignee:
TEXAS INSTRUMENTS INCORPORATED, Dallas, TX (US);
Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/522 (2006.01); H01L 23/538 (2006.01); H01L 23/532 (2006.01); H01L 25/07 (2006.01); H01L 49/02 (2006.01); H01L 23/00 (2006.01); H01L 25/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/5226 (2013.01); H01L 23/5383 (2013.01); H01L 23/5386 (2013.01); H01L 23/5389 (2013.01); H01L 23/53228 (2013.01); H01L 24/09 (2013.01); H01L 25/072 (2013.01); H01L 25/50 (2013.01); H01L 28/40 (2013.01); H01L 2224/0231 (2013.01); H01L 2224/02373 (2013.01); H01L 2224/02381 (2013.01);
Abstract
A packaged electronic device includes a semiconductor die with an electronic component and a contact structure connected to the electronic component, as well as an organic panel frame, a lamination structure that partially embeds the semiconductor die in an opening of the organic panel frame, and a ceramic substrate mounted to a first side of the semiconductor die.