logo

For the Inventor, By the Inventor

The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11865665 B1

PDFFull Text
Date of Patent:
Jan. 09, 2024

Filed:

Oct. 17, 2018

Polishing apparatus

Applicant:

Ebara Corporation, Tokyo, JP;

Inventors:

Kenichi Kobayashi, Tokyo, JP;

Masayuki Nakanishi, Tokyo, JP;

Makoto Kashiwagi, Tokyo, JP;

Manao Hoshina, Tokyo, JP;

Assignee:

EBARA CORPORATION, Tokyo, JP;

Attorney:

BakerHostetler

Primary Examiner:

Keath T Chen

Assistant Examiner:

Margaret Klunk

Int. Cl.
CPC ...
H01L 21/02 (2006.01); H01L 21/67 (2006.01); B24B 37/005 (2012.01); H01L 21/687 (2006.01); B24B 21/00 (2006.01); B24B 37/04 (2012.01); B24B 21/10 (2006.01); B24B 37/30 (2012.01); B24B 41/06 (2012.01); B24B 7/22 (2006.01); B24B 37/10 (2012.01);
U.S. Cl.
CPC ...
B24B 37/042 (2013.01); B24B 7/228 (2013.01); B24B 21/004 (2013.01); B24B 21/008 (2013.01); B24B 21/10 (2013.01); B24B 37/005 (2013.01); B24B 37/105 (2013.01); B24B 37/30 (2013.01); B24B 41/067 (2013.01); H01L 21/0209 (2013.01); H01L 21/67034 (2013.01); H01L 21/67051 (2013.01); H01L 21/68728 (2013.01); H01L 21/68742 (2013.01); H01L 21/68764 (2013.01);
Abstract

A polishing apparatus which can efficiently polish an entirety of a back surface of a substrate, with the back surface facing downward, is disclosed. The polishing apparatus includes: a substrate holder configured to rotate the substrate; a polishing head configured to polish the back surface of the substrate; a tape advancing device; and a translational rotating mechanism configured to cause the polishing head to make a translational rotating motion. The substrate holder includes a plurality of rollers which are rotatable about their own axes. The plurality of rollers have substrate-holding surfaces capable of contacting a periphery of the substrate. The polishing head is disposed below the substrate-holding surfaces. The polishing head includes a polishing blade configured to press the polishing tape against the back surface of the substrate, and a pressing mechanism configured to push the polishing blade upward.

Find Patent Forward Citations

Kobayashi, Kenichi. (2024). Polishing apparatus (U.S. Patent No. 11865665). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11865665

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Loading…