The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 02, 2024

Filed:

Jul. 16, 2021
Applicant:

Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;

Inventor:

I-Che Lee, Hsinchu, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/311 (2006.01); H01L 49/02 (2006.01); H01L 23/48 (2006.01); H01L 21/3213 (2006.01);
U.S. Cl.
CPC ...
H01L 28/88 (2013.01); H01L 21/31144 (2013.01); H01L 21/32139 (2013.01); H01L 23/481 (2013.01);
Abstract

A method of forming a semiconductor structure including a metal-insulator-metal (MIM) capacitor includes: forming a stack structure over a substrate, wherein the stack structure includes a plurality of electrode material layers and a plurality of insulating material layers alternately stacked over the substrate; forming a mask layer on the stack structure; and performing a patterning process on the stack structure, so as to form the MIM capacitor comprising alternately stacked electrodes and insulating layers. Performing the patterning process includes: performing a first etching process to remove a first portion of the stack structure exposed by the mask layer; performing a first trimming process on the mask layer to remove a portion of the mask layer, and a first trimmed mask layer is formed; and performing a second etching process to remove a second portion of the stack structure exposed by the first trimmed mask layer.


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