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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11862505 B1

PDFFull Text
Date of Patent:
Jan. 02, 2024

Filed:

Feb. 15, 2022

Processing apparatus

Applicant:

Disco Corporation, Tokyo, JP;

Inventors:

Yoshinori Kakinuma, Tokyo, JP;

Takashi Mori, Tokyo, JP;

Yoshinobu Saito, Tokyo, JP;

Assignee:

DISCO CORPORATION, Tokyo, JP;

Attorney:

Greer Burns & Crain Ltd.

Primary Examiner:

Philip C Tucker

Assistant Examiner:

Nickolas R Harm

Int. Cl.
CPC ...
B32B 43/00 (2006.01); H01L 21/683 (2006.01); H01L 21/677 (2006.01); B23K 26/364 (2014.01); B23K 26/402 (2014.01); B25J 11/00 (2006.01); H05B 1/02 (2006.01); B23K 103/00 (2006.01);
U.S. Cl.
CPC ...
H01L 21/6836 (2013.01); B23K 26/364 (2015.10); B23K 26/402 (2013.01); B25J 11/0095 (2013.01); H01L 21/67775 (2013.01); H01L 21/6838 (2013.01); B23K 2103/56 (2018.08); B32B 43/006 (2013.01); H05B 1/0233 (2013.01); Y10T 156/1158 (2015.01); Y10T 156/1917 (2015.01);
Abstract

A processing apparatus includes a wafer carrying-out unit, a wafer table that supports a wafer carried out, a frame carrying-out unit, a frame table that supports an annular frame carried out, a tape sticking unit that sticks a tape to the frame, a tape-attached frame conveying unit, a tape pressure bonding unit that executes pressure bonding of the tape of a tape-attached frame to a back surface of the wafer, a frame unit carrying-out unit, and a beveled part removing unit that cuts and removes, in a ring manner, a beveled part formed in an outer circumferential surplus region from the wafer of a frame unit.

Find Patent Forward Citations

Kakinuma, Yoshinori. (2024). Processing apparatus (U.S. Patent No. 11862505). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11862505

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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