The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 02, 2024
Filed:
Jun. 14, 2022
Applicant:
Stats Chippac Pte. Ltd., Singapore, SG;
Inventors:
ChangOh Kim, Incheon, KR;
KyoungHee Park, Seoul, KR;
JinHee Jung, Incheon, KR;
OMin Kwon, Gyeonggi-do, KR;
JiWon Lee, Seoul, KR;
YuJeong Jang, Incheon, KR;
Assignee:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/683 (2006.01); H01L 21/48 (2006.01); H01L 23/31 (2006.01); H01L 23/498 (2006.01); H01L 23/552 (2006.01); H01L 23/544 (2006.01);
U.S. Cl.
CPC ...
H01L 21/4814 (2013.01); H01L 21/6835 (2013.01); H01L 23/3121 (2013.01); H01L 23/49822 (2013.01); H01L 23/49838 (2013.01); H01L 23/544 (2013.01); H01L 23/552 (2013.01); H01L 2221/6835 (2013.01); H01L 2221/68322 (2013.01); H01L 2223/54413 (2013.01);
Abstract
A semiconductor device has a semiconductor package including a substrate with a land grid array. A component is disposed over the substrate. An encapsulant is deposited over the component. The land grid array remains outside the encapsulant. A metal mask having a fiducial marker is disposed over the land grid array. A shielding layer is formed over the semiconductor package. The metal mask is removed after forming the shielding layer.