The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 26, 2023
Filed:
Sep. 30, 2019
Applicant:
Advanced Semiconductor Engineering, Inc., Kaohsiung, TW;
Inventor:
Wen-Long Lu, Kaohsiung, TW;
Assignee:
ADVANCED SEMICONDUCTOR ENGINEERING, INC., Kaohsiung, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10N 10/13 (2023.01); H01L 23/38 (2006.01); H10N 10/17 (2023.01); G01N 25/32 (2006.01); H10N 10/01 (2023.01); H10N 10/852 (2023.01); H10N 19/00 (2023.01);
U.S. Cl.
CPC ...
H10N 10/13 (2023.02); H01L 23/38 (2013.01); H10N 10/17 (2023.02); G01N 25/32 (2013.01); H10N 10/01 (2023.02); H10N 10/852 (2023.02); H10N 19/101 (2023.02);
Abstract
A thermal conduction unit includes a conductive via, a periphery conductor and an isolation material. The conductive via includes a first thermoelectric material. The periphery conductor encloses the conductive via and includes a second thermoelectric material. An end of the periphery conductor is electrically connected to an end of the conductive via. The isolation material is interposed between the conductive via and the periphery conductor.