The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 26, 2023

Filed:

Apr. 04, 2022
Applicant:

Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;

Inventors:

Tsung-Che Lu, Hsinchu, TW;

Chin-Ming Fu, Hsinchu, TW;

Chih-Hsien Chang, Hsinchu, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H03K 5/13 (2014.01); H03K 5/135 (2006.01); H03K 5/15 (2006.01); H03K 5/00 (2006.01);
U.S. Cl.
CPC ...
H03K 5/135 (2013.01); H03K 5/15013 (2013.01); H03K 2005/00208 (2013.01);
Abstract

A phase interpolating (PI) system includes: a PI stage configured to receive first and second clock signals and a multi-bit weighting signal, and generate an interpolated clock signal; and an amplifying stage configured to receive and amplify the interpolated clock signal, the amplifying stage including a capacitive component. The capacitive component is tunable to exhibit non-zero capacitances. The capacitive component has a Miller effect configuration resulting in a reduced footprint of the amplifying stage.


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