The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 26, 2023
Filed:
Apr. 30, 2021
Applicant:
Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;
Inventors:
Assignee:
Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/40 (2006.01); H01L 21/768 (2006.01); H01L 21/311 (2006.01); H01L 23/532 (2006.01); H01L 23/522 (2006.01); H01L 29/45 (2006.01); H01L 21/3215 (2006.01); H01L 29/417 (2006.01);
U.S. Cl.
CPC ...
H01L 29/401 (2013.01); H01L 21/31122 (2013.01); H01L 21/76805 (2013.01); H01L 21/76859 (2013.01); H01L 21/76877 (2013.01); H01L 21/3215 (2013.01); H01L 21/76831 (2013.01); H01L 21/76844 (2013.01); H01L 23/5226 (2013.01); H01L 23/53257 (2013.01); H01L 29/41791 (2013.01); H01L 29/456 (2013.01);
Abstract
A semiconductor device and method of manufacture are provided which utilize a remote plasma process which reduces or eliminates segregation of material. By reducing segregation of the material, overlying conductive material can be deposited on a smoother interface. By depositing on smoother interfaces, overall losses of the deposited material may be avoided, which improves the overall yield.