The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 26, 2023

Filed:

Nov. 23, 2021
Applicant:

Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;

Inventors:

Yan-Jhih Huang, Hsinchu, TW;

Chun-Yuan Hsu, Hsinchu, TW;

Chien-Chung Chen, Hsinchu, TW;

Yung-Hsieh Lin, Hsinchu, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/522 (2006.01); H01L 27/02 (2006.01); H01L 49/02 (2006.01); H01L 21/28 (2006.01); H10B 41/30 (2023.01);
U.S. Cl.
CPC ...
H01L 28/60 (2013.01); H01L 23/5223 (2013.01); H01L 28/87 (2013.01); H01L 23/5222 (2013.01); H01L 27/0207 (2013.01); H01L 28/40 (2013.01); H01L 29/40114 (2019.08); H01L 2924/00 (2013.01); H01L 2924/0002 (2013.01); H10B 41/30 (2023.02);
Abstract

A semiconductor device includes a substrate. The semiconductor device further includes a circuit layer over the substrate. The semiconductor device further includes a test line electrically connected to the circuit layer. The semiconductor device further includes a capacitor on the substrate. The capacitor includes a first conductor, wherein the first conductor is on a portion of the substrate exposed by the circuit layer. The capacitor further includes an insulator surrounding the first conductor.


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