The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 26, 2023
Filed:
Jun. 15, 2020
Changxin Memory Technologies, Inc., Hefei, CN;
Ling-Yi Chuang, Hefei, CN;
CHANGXIN MEMORY TECHNOLOGIES, INC., Hefei, CN;
Abstract
The disclosed semiconductor structure includes a semiconductor substrate, a metal pad, a bump, a first solder layer, a barrier layer, and a second solder layer. The metal pad is disposed on the semiconductor substrate; the bump is arranged on the metal pad; the barrier layer is configured on the side of the bump away from the metal pad. The barrier layer includes a first surface and a second surface. The first solder layer is arranged between the bump and the first surface of the barrier layer. The second solder layer is configured on the second surface of the barrier layer. Since the first solder layer and the second solder layer are formed by reflowed and melt solder at a high temperature and can be stretched, the height of the second solder can be adjusted automatically, which reduces the non-wetting problem caused by the package substrate deformation after reflow.