The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 26, 2023

Filed:

Jul. 19, 2021
Applicant:

Samsung Electronics Co., Ltd., Suwon-si, KR;

Inventors:

Jang Eun Lee, Hwaseong-si, KR;

Min Joo Lee, Seoul, KR;

Wan Don Kim, Seongnam-si, KR;

Hyeon Jin Shin, Suwon-si, KR;

Hyun Bae Lee, Seoul, KR;

Hyun Seok Lim, Suwon-si, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/532 (2006.01); H10B 12/00 (2023.01); H01L 21/768 (2006.01);
U.S. Cl.
CPC ...
H01L 23/53252 (2013.01); H01L 23/53276 (2013.01); H10B 12/0335 (2023.02); H10B 12/315 (2023.02); H10B 12/482 (2023.02); H01L 21/76885 (2013.01);
Abstract

A semiconductor device is provided. The semiconductor device includes a substrate including an element isolation layer, the element isolation layer defining an active region, a plurality of word lines traversing the active region in a first direction, and a plurality of bit line structures on the substrate and connected to the active region, the plurality of bit line structures extending in a second direction different from the first direction. Each of the plurality of bit line structures includes a ruthenium line wiring including a bottom surface and a top surface opposite to the bottom surface, a lower graphene layer in contact with the bottom surface of the ruthenium line wiring and extending along the bottom surface of the ruthenium line wiring, and a wiring line capping layer extending along the top surface of the ruthenium line wiring.


Find Patent Forward Citations

Loading…