The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 26, 2023
Filed:
Apr. 16, 2021
Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;
Chia-Lun Chen, Taichung, TW;
Po-Jen Shih, Tainan, TW;
Ming-Sung Hung, Taichung, TW;
Wen-Hung Hsu, Taichung, TW;
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD., Hsinchu, TW;
Abstract
A semiconductor wafer cleaning apparatus is provided. The semiconductor wafer cleaning apparatus includes a spin base, a spindle, a clamping member, and a first sealing ring. The spin base has a through hole and a flange. The spindle extends through the through hole. The clamping member covers the through hole and is connected to the spindle. The clamping member includes a mounting part. The first sealing ring is disposed under the clamping member. A top surface of the first sealing ring and a top surface of the flange are in contact with a bottom surface of the mounting part.