The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 26, 2023

Filed:

May. 21, 2021
Applicant:

Raytheon Company, Waltham, MA (US);

Inventors:

Andrew Clarke, Santa Barbara, CA (US);

David R. Rhiger, Goleta, CA (US);

George Grama, Lompoc, CA (US);

Stuart B. Farrell, Goleta, CA (US);

Assignee:

Raytheon Company, Waltham, MA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 31/18 (2006.01); C30B 25/18 (2006.01); C30B 29/40 (2006.01); C30B 29/60 (2006.01);
U.S. Cl.
CPC ...
C30B 25/183 (2013.01); C30B 29/403 (2013.01); C30B 29/605 (2013.01); H01L 31/1832 (2013.01); H01L 31/1868 (2013.01);
Abstract

An electrical device includes an aluminum nitride passivation layer for a mercury cadmium telluride (HgCdTe) (MCT) semiconductor layer of the device. The AlN passivation layer may be an un-textured amorphous-to-polycrystalline film that is deposited onto the surface of the MCT in its as-grown state, or overlying the MCT after the MCT surface has been pre-treated or partially passivated, in this way fully passivating the MCT. The AlN passivation layer may have a coefficient of thermal expansion (CTE) that closely matches the CTE of the MCT layer, thereby reducing strain at an interface to the MCT. The AlN passivation layer may be formed with a neutral inherent (residual) stress, provide mechanical rigidity, and chemical resistance to protect the MCT.


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