The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 26, 2023

Filed:

Dec. 14, 2020
Applicant:

Tokyo Electron Limited, Tokyo, JP;

Inventor:

Osamu Miyahara, Kumamoto, JP;

Assignee:
Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B24B 29/00 (2006.01); B24B 37/005 (2012.01); H01L 21/02 (2006.01); B24B 57/02 (2006.01); B24B 37/07 (2012.01);
U.S. Cl.
CPC ...
B24B 29/005 (2013.01); B24B 37/005 (2013.01); B24B 37/07 (2013.01); B24B 57/02 (2013.01); H01L 21/02013 (2013.01); H01L 21/02052 (2013.01);
Abstract

A substrate processing apparatus includes: a holding part for holding a substrate; a rotating part for rotating the holding part to rotate the substrate together with the holding part; a liquid supply part for supplying a cleaning liquid to a main surface of the substrate; a polishing head for polishing the main surface; a moving part for scanning the polishing head in a radial direction of the substrate while pressing the polishing head against the main surface; and a controller for controlling the rotating part, the liquid supply part, and the moving part. The controller sets a division line that divides the main surface into plural areas in the radial direction, and controls the liquid supply part to supply the cleaning liquid for each area and controls the moving part to scan the polishing head for each area while a subsequent supply of the cleaning liquid is stopped.


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